Researchers from Lausanne’s Ecole Polytechnique Fédérale (EPFL) have come up with a new approach to electronics that involves engineering metastructures at the sub-wavelength scale. It could launch the next generation of ultra-fast devices for exchanging massive amounts of data, with applications in 6G communications and beyond, the institution announced in a press release.
Until now, the ability to make electronic devices faster has come down to a simple principle: scaling down transistors and other components. But this approach is reaching its limit, as the benefits of shrinking are counterbalanced by detrimental effects like resistance and decreased output power.
More information, smaller devices
Elison Matioli of the Power and Wide-band-gap Electronics Research Lab (POWERlab) in EPFL’s School of Engineering explains that further miniaturization is therefore not a viable solution to better electronics performance.
“New papers come out describing smaller and smaller devices, but in the case of materials made from gallium nitride, the best devices in terms of frequency were already published a few years back,” he says. “After that, there is really nothing better, because as device size is reduced, we face fundamental limitations. This is true regardless of the material used.”
In response to this challenge, Matioli and PhD student Mohammad Samizadeh Nikoo came up with a new approach to electronics that could overcome these limitations and enable a new class of terahertz devices. Instead of shrinking their device, they rearranged it, notably by etching patterned contacts called metastructures at sub-wavelength distances onto a semiconductor made of gallium nitride and indium gallium nitride. These metastructures allow the electrical fields inside the device to be controlled, yielding extraordinary properties that do not occur in nature.
6G and beyond
As Samizadeh Nikoo explains, modulating terahertz waves is crucial for the future of telecommunications, as the increasing data requirements of technologies like autonomous vehicles and 6G mobile communications are fast reaching the limits of today’s devices.
The electronic metadevices developed in the POWERlab could form the basis for integrated terahertz electronics by producing compact, high-frequency chips that can already be used with smartphones, for example.
“This new technology could change the future of ultra-high-speed communications, as it is compatible with existing processes in semiconductor manufacturing. We have demonstrated data transmission of up to 100 gigabits per second at terahertz frequencies, which is already 10 times higher than what we have today with 5G,” Samizadeh Nikoo says.
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